Manufacturing and Life Cycle Management Concerns
A category in the Common Weakness Enumeration published by The MITRE Corporation.
Categories in the Common Weakness Enumeration (CWE) group entries based on some common characteristic or attribute.
Weaknesses in this category are root-caused to defects that arise in the semiconductor-manufacturing process or during the life cycle and supply chain.
The credentials necessary for unlocking a device are shared across multiple parties and may expose sensitive information.
The product does not properly provide a capability for the product administrator to remove sensitive data at the time the product is decommissioned. A scrubbing capab...
Information stored in hardware may be recovered by an attacker with the capability to capture and analyze images of the integrated circuit using techniques such as sca...
The product released to market is released in pre-production or manufacturing configuration.
The security-sensitive hardware module contains semiconductor defects.
The product does not adequately protect confidential information on the device from being accessed by Outsourced Semiconductor Assembly and Test (OSAT) vendors.
This view organizes weaknesses around concepts that are frequently used or encountered in hardware design. Accordingly, this view can align closely with the perspectiv...